This inventor holds 1 USPTO granted patent. Top assignee: Hangzhou Guangzhiyuan Technology Co., Ltd.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Shanshan Yu: Innovator in Photonic-Electronic Chip Packaging
Introduction
Shanshan Yu is a prominent inventor based in Hangzhou, China. She has made significant contributions to the field of photonic-electronic chip technology. Her innovative approach has led to the development of a unique packaging method that enhances the functionality of electronic components.
Latest Patents
Shanshan Yu holds 1 patent for her invention titled "Three-dimensional packaging method and package structure of photonic-electronic chip." This patent describes a method that involves fixing an electronic chip on a specific area of a photonic chip's surface. Additionally, it includes the use of a dummy chip that has a cavity designed to cover an optical coupling interface, thereby improving the overall efficiency of the chip packaging.
Career Highlights
Shanshan Yu is currently employed at Hangzhou Guangzhiyuan Technology Co., Ltd. Her work at this company focuses on advancing technologies related to photonic-electronic integration. She has demonstrated exceptional skill in her field, contributing to the company's reputation for innovation.
Collaborations
Shanshan collaborates with talented individuals such as Yichen Shen and Samuel Jiang. Their teamwork fosters a creative environment that drives technological advancements in their projects.
Conclusion
Shanshan Yu is a trailblazer in the realm of photonic-electronic chip packaging. Her innovative methods and collaborative spirit continue to push the boundaries of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile