Company Filing History:
Years Active: 2007
Title: The Innovative Contributions of Shang-Yu Hou in Semiconductor Technology
Introduction: Shang-Yu Hou, based in Jubei, Taiwan, is a notable inventor recognized for his contributions to semiconductor technology. With a single patent to his name, he has made significant strides in enhancing the reliability of semiconductor bond pad structures, vital for the successful functioning of modern electronic devices.
Latest Patents: Shang-Yu Hou holds a patent titled "Semiconductor bond pad structures and methods of manufacturing thereof." This innovation describes a semiconductor device designed to improve bond pad reliability. The device features a unique layer formed over an integrated circuit on a semiconductor substrate, comprising both conductive and insulating portions. A second layer is then added, aligning with the first layer's features. Ultimately, a bond pad is formed on these layers, positioned over the conductive portions, ensuring that a bonding ball can be effectively integrated to enhance connectivity.
Career Highlights: Shang-Yu Hou is affiliated with Taiwan Semiconductor Manufacturing Company Limited, a leading entity in the semiconductor industry. His work there emphasizes the importance of innovative designs in semiconductor devices, contributing towards the advancement of technologies that power countless electronic products on the market today.
Collaborations: Throughout his career, Hou has collaborated with notable colleagues, including Pei-Haw Tsao and Chender Huang. These partnerships have enabled the exchange of ideas and expertise, further driving innovation in their collective work within semiconductor technology.
Conclusion: Shang-Yu Hou's innovative approach to semiconductor bond pad structures underscores his impact in the field. His patent not only signifies his technical acumen but also reflects the collaborative spirit present in the semiconductor industry. As technology continues to evolve, contributions like those of Hou will remain crucial in shaping the future of electronic devices.