This inventor holds 2 USPTO granted patents and 10 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2024-2025.
Company Filing History:
Years Active: 2024-2025
Title: Seungwan Shin: Innovator in Semiconductor Packaging
Introduction
Seungwan Shin is a prominent inventor based in Hwaseong, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
His latest patents include a semiconductor package that features an encapsulant. This semiconductor package consists of a lower redistribution structure, a semiconductor chip, connection conductors, and an upper redistribution structure. The design ensures that the upper redistribution layers do not overlap the connection conductors, creating a multi-layered structure that enhances performance. Another notable patent is a semiconductor package and method of manufacturing the same, which includes a first redistribution structure, a semiconductor chip, and a barrier layer. This design effectively seals the semiconductor chip while allowing for efficient electrical connections.
Career Highlights
Seungwan Shin is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.
Collaborations
He collaborates with talented coworkers such as Gun Goo Lee and Woonchun Kim, contributing to a dynamic team focused on innovation in the semiconductor industry.
Conclusion
Seungwan Shin's contributions to semiconductor packaging reflect his dedication to innovation and excellence. His patents not only enhance the functionality of semiconductor devices but also pave the way for future advancements in the field.