This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Seunghyun Go: Innovator in Semiconductor Packaging
Introduction
Seunghyun Go is a notable inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise.
Latest Patents
Seunghyun Go holds a patent for a semiconductor package. This invention comprises a substrate that includes substrate pads on its top surface, a first upper semiconductor chip on the substrate with conductive chip pads, and bonding wires that connect the substrate pads to the semiconductor chip. The bonding wires consist of first and second bonding wires, with specific configurations that enhance the functionality of the semiconductor package.
Career Highlights
Seunghyun Go is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to develop and refine his innovative ideas, contributing to the advancement of semiconductor technology.
Collaborations
Throughout his career, Seunghyun Go has collaborated with talented coworkers, including Raehyung Do and Jungsik Lee. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Seunghyun Go is a prominent figure in the semiconductor industry, with a patent that reflects his innovative approach to technology. His contributions at Samsung Electronics Co., Ltd. and collaborations with fellow inventors highlight his commitment to advancing the field of semiconductor packaging.