Allen, TX, United States of America

Seunghyun Chae

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seunghyun Chae. Retrieved from https://idiyas.com/inventor/seunghyun-chae-5zwff6wo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seunghyun Chae: Inventor of Sintered Metal Flip Chip Joints.

Introduction

Seunghyun Chae is an inventor associated with Allen, Texas, and Texas Instruments Incorporated. His patent work includes an invention titled “Sintered Metal Flip Chip Joints.”

Latest Patents

Chae is credited with 1 patent: “Sintered Metal Flip Chip Joints.” The title indicates work concerning flip-chip interconnections formed using sintered metal.

Career Highlights

Chae’s listed patent is associated with Texas Instruments Incorporated, a company known for developing semiconductor technologies. The available information identifies his contribution through this patent.

Collaborations

Kurt Peter Wachtler is identified as Chae’s coworker. The provided information does not specify whether they collaborated on the patent.

Conclusion

Seunghyun Chae’s recorded patent activity centers on “Sintered Metal Flip Chip Joints,” reflecting his connection to semiconductor innovation at Texas Instruments Incorporated.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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