Company Filing History:
Years Active: 2017
Title: Seung-won Im: Innovator in Semiconductor Packaging
Introduction
Seung-won Im is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the design and development of semiconductor packages. His innovative work has led to the creation of a patent that addresses critical issues in semiconductor functionality.
Latest Patents
Seung-won Im holds a patent for a semiconductor package that features a leadframe designed to mount a transistor device, which prevents malfunction. The semiconductor package includes a leadframe with multiple transistor die attach pads where both a first and a second transistor device are arranged. Additionally, it incorporates a driver die attach pad for a driver semiconductor chip, along with a first driver lead that is electrically connected to the driver semiconductor chip. A second driver lead is strategically placed between the first driver lead and the transistor die attach pads. The design also includes a chip bonding wire that electrically connects the first transistor device with the driver semiconductor chip, and a first transistor bonding wire that connects the first driver lead with the second transistor device. To enhance safety, a first insulator is arranged on the second driver lead to insulate it from the first transistor bonding wire.
Career Highlights
Seung-won Im is currently employed at Fairchild Korea Semiconductor Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages, which are crucial components in various electronic devices.
Collaborations
Throughout his career, Seung-won Im has collaborated with talented colleagues, including O-seob Jeon and Joon-seo Son. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Seung-won Im's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent reflects a commitment to enhancing the functionality and reliability of semiconductor devices. As he continues his work at Fairchild Korea Semiconductor Ltd., his impact on the industry is sure to grow.