This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2012-2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012-2020
Title: Seung-Weon Ha: Innovator in Multi-Chip Package Technology
Introduction
Seung-Weon Ha is a notable inventor based in Cheonan, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of multi-chip packages. With a total of 4 patents to his name, Ha's work has had a considerable impact on the industry.
Latest Patents
Ha's latest patents include innovative methods for manufacturing multi-chip packages. One of his patents describes a multi-chip package that features a package substrate with a first substrate pad. This design includes a first group of semiconductor chips stacked on the substrate, each equipped with bonding pads. The patent outlines the arrangement of first stud bumps on the bonding pads, excluding the lowermost semiconductor chip. Additionally, it details a first conductive wire that extends downward from the bonding pad of the lowermost chip, connecting to the first substrate pad, and a second conductive wire that extends upward, sequentially connecting to the first stud bumps.
Another patent elaborates on a similar multi-chip package and the method of manufacturing it. This innovation emphasizes the efficiency and effectiveness of the multi-chip package design, showcasing Ha's expertise in semiconductor technology.
Career Highlights
Seung-Weon Ha is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the advancement of semiconductor packaging solutions.
Collaborations
Throughout his career, Ha has collaborated with talented individuals such as Won-Gil Han and Yong-Je Lee. These collaborations have fostered a creative environment that has led to the development of innovative technologies in the semiconductor field.
Conclusion
Seung-Weon Ha is a distinguished inventor whose work in multi-chip package technology has made a significant impact on the semiconductor industry. His innovative patents and contributions at Samsung Electronics Co., Ltd. highlight his expertise and dedication to advancing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
