Daejeon-si, South Korea

Seung Uk Yoon

USPTO Granted Patents = 4 

Average Co-Inventor Count = 6.1

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2016)
  • Daejeon-si, KR (2019)
  • Daejeon, KR (2018 - 2021)

Company Filing History:


Years Active: 2016-2021

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4 patents (USPTO):Explore Patents

Title: Seung Uk Yoon: Innovator in 3D Imaging and Printing Technologies

Introduction

Seung Uk Yoon is a prominent inventor based in Daejeon-si, South Korea. He has made significant contributions to the fields of 3D imaging and printing technologies. With a total of four patents to his name, Yoon continues to push the boundaries of innovation in his field.

Latest Patents

Yoon's latest patents include a method and system for generating a 3D image of a character. This innovative method involves receiving an identifier of a template and a two-dimensional (2D) image of the character. The process includes acquiring template information from a library and extracting effective parameters for machine learning to generate the 3D image. Another notable patent is an apparatus and method for generating a 3D printing model using multiple textures. This apparatus includes a template model storage unit, a 3D model conversion unit, a texture processing unit, and a 3D printing model output unit, all designed to enhance the 3D printing process.

Career Highlights

Seung Uk Yoon is affiliated with the Electronics and Telecommunications Research Institute, where he applies his expertise in developing advanced technologies. His work has garnered attention for its practical applications in various industries.

Collaborations

Yoon collaborates with talented individuals such as Bon Woo Hwang and Seong Jae Lim, contributing to a dynamic research environment that fosters innovation.

Conclusion

Seung Uk Yoon is a key figure in the realm of 3D imaging and printing, with a focus on creating technologies that enhance visual representation and manufacturing processes. His contributions continue to shape the future of these fields.

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