Company Filing History:
Years Active: 2020-2023
Title: Seung-Tae Hwang: Innovator in Chip on Film Technology
Introduction
Seung-Tae Hwang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of chip on film packages. With a total of 3 patents to his name, Hwang continues to push the boundaries of innovation in his field.
Latest Patents
One of Hwang's latest patents is focused on a chip on film package and display device that includes a flexible base film. This film has a first surface and a second surface opposite to each other, featuring a chip mounting region on the first surface. The design incorporates a plurality of wirings extending in a first direction toward the chip mounting region. A semiconductor chip is mounted in the chip mounting region and is electrically connected to the wirings. Additionally, the package includes a pair of first heat dissipation members on the first surface of the base film, spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction. A second heat dissipation member covers the semiconductor chip and the pair of first heat dissipation members, enhancing the overall efficiency of the device.
Career Highlights
Seung-Tae Hwang is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of semiconductor devices, particularly in the realm of flexible electronics.
Collaborations
Hwang has collaborated with notable colleagues, including Jae-Choon Kim and Kyung-suk Oh. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Seung-Tae Hwang is a key figure in the semiconductor industry, known for his innovative work on chip on film technology. His contributions have not only advanced the field but also set the stage for future developments in flexible electronics.