Company Filing History:
Years Active: 2014-2016
Title: Seung Man Choi: Innovator in Through-Silicon Via Technology
Introduction
Seung Man Choi is a notable inventor based in Loudonville, NY (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of Through-Silicon Via (TSV) structures. With a total of 2 patents to his name, Choi's work focuses on enhancing the performance and reliability of electronic devices.
Latest Patents
Choi's latest patents revolve around a novel process integration for air gap formation at the sidewalls of TSV structures. This innovative approach reduces parasitic capacitance and depletion regions between the substrate silicon and TSV conductor. Additionally, it serves to minimize mechanical stress in the silicon substrate surrounding the TSV conductor. His work in this area represents a significant advancement in semiconductor manufacturing techniques.
Career Highlights
Seung Man Choi is currently employed at GlobalFoundries Inc., where he continues to push the boundaries of semiconductor technology. His expertise in TSV structures has positioned him as a key player in the industry, contributing to the development of more efficient and reliable electronic components.
Collaborations
Choi collaborates with various professionals in his field, including his coworker Shan Gao. These collaborations enhance the innovation process and lead to the development of cutting-edge technologies.
Conclusion
Seung Man Choi's contributions to Through-Silicon Via technology highlight his role as a leading inventor in the semiconductor industry. His innovative patents and career at GlobalFoundries Inc. underscore his commitment to advancing technology for better electronic performance.