Seung Kyu Lim

Title: **Seung Kyu Lim: Innovator in Package Substrate Fabrication**

Introduction

Seung Kyu Lim is a notable inventor based in Uiwang, South Korea. With one patent to his name, he has made significant contributions to the field of packaging technology, particularly in the fabrication of package substrates.

Latest Patents

His patented innovation is a method of fabricating a package substrate. This method includes several critical steps: forming a cavity in at least one region of an upper surface of a wafer, which consists of a chip mounting region; creating a through-hole that penetrates through the wafer and a via that fills the through-hole; and developing a first and second wiring layer that are spaced apart and extended into the cavity. The method distinguishes itself by allowing a chip to be mounted in the cavity and connected to both wiring layers, enhancing the functionality and efficiency of semiconductor applications.

Career Highlights

Seung Kyu Lim has worked at prominent institutions, including Samsung Electro-mechanics Co., Ltd. and the Sungkyunkwan University Foundation for Corporate Collaboration. His career reflects a commitment to advancing semiconductor packaging techniques, which are vital in the electronics industry.

Collaborations

Throughout his career, Seung Kyu Lim has collaborated with notable colleagues, including Seung Wook Park and Young Do Kweon. These collaborations have likely fostered an environment of innovation and have contributed to the success of his patent and further advancements in his field.

Conclusion

Seung Kyu Lim stands as a significant figure in the study and innovation of package substrate fabrication. His contributions through innovative methods underscore the importance of research and collaboration in driving technological advancements within the semiconductor industry.