Seongnam, South Korea

Seung-Hui Woo

This inventor holds 1 USPTO granted patent. Top assignee: Korea University Research and Business Foundation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seung-Hui Woo. Retrieved from https://idiyas.com/inventor/seung-hui-woo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Seung-Hui Woo and a Fabric-Based Flexible Electrode

Introduction

Seung-Hui Woo is an inventor associated with Seongnam, South Korea, and the Korea University Research and Business Foundation. His patent work concerns a flexible electrode built on fabric, combining textile fibers with layers designed to support metallic coating and electroplating.

Latest Patents

Woo is credited with 1 patent: “Fabric Material-Based Flexible Electrode and Manufacturing Method Thereof.” The invention describes a substrate made of intersecting fibers, a bonding layer containing an adsorbed amine-group monomolecular substance, and a nanoparticle layer coated with metallic nanoparticles. A predetermined metal is then electroplated onto the nanoparticle layer to form the electrode. The patent also covers a method for manufacturing this fabric-based flexible electrode.

Career Highlights

Woo’s listed patent connects his work with research and commercialization activities at the Korea University Research and Business Foundation. The invention’s layered construction applies electrode materials to a flexible textile substrate.

Collaborations

The patent lists Jinhan Cho and Donghyeon Nam as Woo’s coworkers.

Conclusion

Seung-Hui Woo’s patent presents a fabric-based approach to flexible electrodes, combining intersecting fibers, an amine-containing bonding layer, metallic nanoparticles, and electroplated metal.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…