This inventor holds 20 USPTO granted patents and 4 published patent applications. Top assignees: Eastman-Kodak Company, Carestream Health, Inc.. Active years: 1992-2013.
Company Filing History:
Years Active: 1992-2013
Title: The Innovative Contributions of Seung-Ho Baek
Introduction
Seung-Ho Baek, an accomplished inventor based in Pittsford, NY, has made significant strides in the field of electronic device assembly and integrated circuit manufacturing. With a remarkable portfolio of 20 patents, he has focused on enhancing the efficiency and effectiveness of integrated circuit chips.
Latest Patents
Seung-Ho Baek's latest innovations include the "Thermal Barrier Layer for Integrated Circuit Manufacture," which introduces methods and systems for assembling electronic devices, such as IC chips. This patent outlines a process whereby IC elements are selectively embedded into a chip substrate using an activatable thermal barrier material, allowing for a more efficient assembly process. Additionally, his invention of the "Low Cost Die Release Wafer" employs a release member with a phase change material, which facilitates the scalable assembly of IC chips. This innovative approach allows IC components to be selectively stored and released efficiently, potentially reducing costs in the assembly process.
Career Highlights
Throughout his career, Seung-Ho Baek has been associated with renowned companies, including Eastman Kodak Company and Carestream Health, Inc. His work has largely revolved around enhancing electronic manufacturing processes, making him a significant contributor to advancements in this field.
Collaborations
Seung-Ho Baek has collaborated with notable colleagues, including Roger Stanley Kerr and Timothy John Tredwell. These partnerships have likely influenced his innovative approaches and contributed to the successful development of his patented technologies.
Conclusion
In summary, Seung-Ho Baek stands out as a prominent inventor whose innovative patents have paved the way for advancements in integrated circuit manufacturing. Through his work and collaborations, he continues to contribute significantly to the field of electronic devices, demonstrating a commitment to innovation and excellence.