Seoul, South Korea

Seung Hee Oh

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seung Hee Oh. Retrieved from https://idiyas.com/inventor/seung-hee-oh-1c6ae6w9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019

Loading Chart...
Loading Chart...
1 patent (USPTO):Explore Patents

Title: Seung Hee Oh: Inventor in Fingerprint Recognition Technology.

Introduction

Seung Hee Oh is an inventor based in Seoul, South Korea. His work includes a patent for fingerprint recognition technology designed for use in electronic devices.

Latest Patents

Oh is associated with 1 patent: “Fingerprint Recognition Device, Method of Manufacturing the Same, and Electronic Device Thereof.” The invention describes a fingerprint recognition device with an integrated circuit electrically connected to one or more sensor electrodes. A first circuit board sits above the integrated circuit and carries the sensor electrode, while a second circuit board is positioned beneath the integrated circuit and electrically connected to the first board. A molding layer surrounds the integrated circuit to protect it, and a connection part electrically links the two circuit boards.

Career Highlights

Oh is associated with Samsung Electronics Co., Ltd. His patented work addresses the structure and manufacture of fingerprint recognition hardware for electronic devices.

Collaborations

Oh’s listed coworkers include Young Jun Moon and Tae Sang Park.

Conclusion

Seung Hee Oh’s patent focuses on integrating sensor electrodes, circuit boards, and protective molding into a fingerprint recognition device for electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…