Seung-Chui Ahn

Title: Seung-Chui Ahn: A Pioneer in Die Bonding Technology

Introduction

Seung-Chui Ahn, a notable inventor based in Choongchungnam-do, South Korea, has made significant contributions to the field of semiconductor packaging. With a keen focus on innovative solutions, he has developed a patented technology that enhances the manufacturing process of fine pitch ball grid array packages.

Latest Patents

Ahn holds a patent for a "Die bonding method for manufacturing fine pitch ball grid array packages." This advanced die bonding equipment is designed specifically for the precise bonding of semiconductor chips. It features a semiconductor chip pickup stage for inspecting the status of loaded chips and their corresponding positions. The alignment stage allows for the accurate positioning of the semiconductor chip, while the chip transfer unit efficiently moves the chip from the pickup stage to the alignment stage. With a guide rail facilitating the mount tape frame and a status inspecting unit monitoring the land pattern's condition, this technology ensures that only semiconductor chips matching the status (good or defective) are bonded to their respective land patterns.

Career Highlights

Throughout his career, Seung-Chui Ahn has been instrumental in driving innovations at Samsung Electronics Co., Ltd. His expertise in semiconductor technology has not only advanced the company's capabilities but has also set new industry standards for quality and efficiency in chip bonding processes. His work demonstrates the critical link between innovation and practical application in technology-driven companies.

Collaborations

Ahn has worked closely with his colleague, Sang-Geun Kim, combining their skills and knowledge to push the boundaries of semiconductor manufacturing. Their collaboration exemplifies the importance of teamwork in achieving significant technological advancements.

Conclusion

Seung-Chui Ahn's contributions to the semiconductor industry through his innovative die bonding method highlight the vital role inventors play in shaping technology. With his patent underlining his achievements, Ahn continues to inspire future innovations in semiconductor packaging and manufacturing.