Polk, OH, United States of America

Seth W Brokaw

This inventor holds 1 USPTO granted patent. Top assignee: Alamo Group Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seth W Brokaw. Retrieved from https://idiyas.com/inventor/seth-w-brokaw

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Seth W. Brokaw

Introduction

Seth W. Brokaw is an accomplished inventor based in Polk, Ohio. He has made significant contributions to the field of machinery with his innovative designs. His work primarily focuses on enhancing the efficiency and functionality of equipment used in various industries.

Latest Patents

One of Seth W. Brokaw's notable patents is for a stump grinder equipped with a helical rotary actuator. This invention features a machine body with a helical rotary actuator mounted to it, which includes a central axis. The design incorporates a support mounted to the actuator, along with an arm that holds a cutting wheel. A motor drives the cutting wheel, while the helical rotary actuator allows for movement along an arcuate path about the central axis. This innovative design improves the effectiveness of stump grinding operations.

Career Highlights

Seth W. Brokaw is associated with Alamo Group Inc., a company known for its commitment to manufacturing high-quality outdoor equipment. His role at the company has allowed him to apply his inventive skills to develop practical solutions for the industry.

Conclusion

Seth W. Brokaw's contributions to the field of machinery through his innovative stump grinder design exemplify his dedication to improving equipment functionality. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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