Cedarburg, WI, United States of America

Seth Edward Kampa

This inventor holds 1 USPTO granted patent and 3 published patent applications and 1 EPO patent. Top assignee: Rytec Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seth Edward Kampa. Retrieved from https://idiyas.com/inventor/seth-edward-kampa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seth Edward Kampa: Innovator in Door Assembly Technology

Introduction

Seth Edward Kampa is an inventive mind based in Cedarburg, Wisconsin. He is currently associated with Rytec Corporation, where he contributes to the development of innovative door assembly technologies. Although he does not hold any granted patents, his work in the field is noteworthy.

Latest Patent Applications

Seth has submitted several patent applications, including:

1. **Door Assembly Having a Soft Bottomed Door Panel and System and Method of Driving the Same** - This application describes a door assembly that includes a first side column and a second side column positioned near a doorway. Each side column features guide tracks that form a guide channel accessible from the doorway. The guide tracks are made from a more flexible material than the guide track holders, allowing for efficient movement of the door panel.

2. **Door Assembly Having a Soft Bottomed Door Panel and System and Method of Driving the Same** - This application outlines a door assembly where a door panel is fixed to a drum that can rotate in both directions. The assembly includes side columns with guide tracks to facilitate the movement of the door panel as it opens and closes.

Conclusion

Seth Edward Kampa is a dedicated inventor focused on enhancing door assembly technology through his innovative applications. His contributions to the field, although not yet patented, reflect his commitment to advancing engineering solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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