Stockton, CA, United States of America

Seshadri Conjeevaram


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 340(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: Seshadri Conjeevaram: Innovator in Bone-Implant Technology

Introduction

Seshadri Conjeevaram is a notable inventor based in Stockton, CA, who has made significant contributions to the field of biomedical engineering. His innovative work focuses on developing advanced materials for medical applications, particularly in bone-implant technology.

Latest Patents

Conjeevaram holds a patent for a moldable bone-implant material. This material consists of between about 65%-95% hard filler particles and a binder composed of between about 35%-5% of a biocompatible, biodegradable, thermoplastic polymer. The polymer exhibits fluidic flow properties at or below about 60 degrees Celsius. A preferred binder is polylactic acid, which has a molecular weight between about 400 and 5,000 daltons, while a preferred hard filler is hydroxylapatite. When used, the material is warmed to a temperature that allows molding, filling the bone site with the moldable material. This material then forms a contour-fitting, semi-rigid implant that retains its shape and acquires a rigid final state as the binder is gradually biodegraded and replaced through tissue ingrowth from the surrounding bone site.

Career Highlights

Conjeevaram is associated with Orthomatrix, Inc., where he continues to develop innovative solutions in the field of bone implants. His work has the potential to significantly improve patient outcomes in orthopedic surgeries.

Collaborations

He has collaborated with notable colleagues such as Steve T Lin and Don J Henderson, contributing to advancements in their shared field of expertise.

Conclusion

Seshadri Conjeevaram's contributions to the development of moldable bone-implant materials highlight his innovative spirit and dedication to improving medical technology. His work is paving the way for future advancements in orthopedic implants.

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