Tampere, Finland

Seppo Holkko

This inventor holds 1 USPTO granted patent. Top assignee: Oy Tampella Ab. Active years: 1979.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seppo Holkko. Retrieved from https://idiyas.com/inventor/seppo-holkko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1979

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1 patent (USPTO):Explore Patents

Title: Seppo Holkko: Innovator in Paper Machine Technology

Introduction

Seppo Holkko is a notable inventor based in Tampere, Finland. He has made significant contributions to the field of paper machine technology, particularly with his innovative designs that enhance efficiency and performance.

Latest Patents

Holkko holds a patent for an "Extended nip press for a paper machine." This invention is designed to remove water from a fiber web carried by a porous felt through a press zone. The press utilizes press rolls that form at least two separate press nips, along with a sealing element positioned between the rolls. This design allows for effective pressure action on the web, felt, and supporting band as they pass through the press nips.

Career Highlights

Seppo Holkko is associated with Oy Tampella Ab, a company known for its advancements in paper machinery. His work has been instrumental in developing technologies that improve the efficiency of paper production processes.

Collaborations

Holkko has collaborated with notable colleagues such as Jukka A Lehtinen and Pekka Majaniemi, contributing to the advancement of paper machine technology through teamwork and shared expertise.

Conclusion

Seppo Holkko's innovative contributions to paper machine technology, particularly through his patented designs, highlight his role as a key figure in the industry. His work continues to influence the efficiency of paper production processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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