Suwon-si, South Korea

Seongseob Shin

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seongseob Shin. Retrieved from https://idiyas.com/inventor/seongseob-shin-19mkohyh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seongseob Shin and Semiconductor Test Innovation.

Introduction

Seongseob Shin is an inventor based in Suwon-si, South Korea, and is associated with Samsung Electronics Ltd. His work includes an invention designed to support temperature verification during semiconductor testing.

Latest Patents

Shin is credited with 1 patent: “Test Device and Semiconductor Manufacturing Apparatus Including Test Device.” The invention describes a test board with a connector, a heating device, a temperature sensor, and a test socket. The heating device emits heat in response to a signal received through the connector, while the sensor measures its temperature. The test socket transmits and receives signals to and from the heating device and sensor. By allowing the chamber’s internal temperature to be checked before or after a test process, the device is intended to improve test reliability.

Career Highlights

Shin’s listed patent reflects work related to semiconductor manufacturing equipment and temperature verification. The available information associates him with Samsung Electronics Ltd.

Collaborations

Shin’s listed coworkers include Jihyun Choi and Seonmi Lee. The provided information does not specify their roles in the patent or their contributions to the invention.

Conclusion

Seongseob Shin’s patent addresses temperature verification in semiconductor testing, with the goal of supporting more reliable test processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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