Paju-si, South Korea

Seongjun Kim

This inventor holds 1 USPTO granted patent. Top assignee: Lg Display., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seongjun Kim. Retrieved from https://idiyas.com/inventor/seongjun-kim-rtnygmz6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seongjun Kim and Electroluminescent Display Innovation

Introduction

Seongjun Kim is an inventor associated with Paju-si, South Korea, and LG Display Co., Ltd. His listed patent work concerns an electroluminescent display design intended to reduce electromagnetic interference.

Latest Patents

Kim is credited with 1 patent: “Electroluminescent Display Device Capable of Reducing Electromagnetic Interference.” The invention describes a display part covered by an encapsulation unit and a heat-dissipation sheet. The encapsulation unit uses first and second adhesive layers with a barrier layer between them. A hole through the second adhesive layer and barrier layer allows conductive paste to electrically connect the barrier layer’s side surface to the heat-dissipation sheet. This arrangement is designed to improve electromagnetic-interference performance.

Career Highlights

The available information associates Kim with LG Display Co., Ltd., a company working in display technology. His listed patent reflects an engineering approach that combines display encapsulation, heat dissipation, and electrical connection to address electromagnetic interference.

Collaborations

Kim’s listed coworker is MinJoo Kang. The provided information does not specify the nature of their collaboration or whether they worked together on this patent.

Conclusion

Seongjun Kim’s listed invention focuses on reducing electromagnetic interference in electroluminescent displays through a conductive connection integrated into the device’s encapsulation and heat-dissipation structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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