This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Seonghoon Bae: Innovator in Semiconductor Packaging
Introduction
Seonghoon Bae is an inventor based in Suwon-si, South Korea. He is focused on advancements in semiconductor packaging technology. Although he currently holds no granted patents, his work in the field is noteworthy.
Latest Patent Applications
Seonghoon Bae has submitted several patent applications that showcase his innovative ideas. One of his latest applications is for a semiconductor package and method of manufacturing the semiconductor package. This design includes a lower redistribution wiring layer with distinct regions, a semiconductor chip, and a molding member. It also features vertical conductive structures that penetrate the molding member, enhancing electrical connections.
Another application involves semiconductor packages that incorporate dummy posts. This design includes a lower redistribution structure with an insulating layer and connection pads. A semiconductor chip is mounted on this structure, and conductive posts are utilized for connections. The height of the dummy posts is intentionally smaller than that of the conductive posts, which is a unique aspect of this design.
Conclusion
Seonghoon Bae is making strides in the semiconductor packaging industry through his innovative patent applications. His work reflects a commitment to advancing technology in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile