SeongBo Shim

Title: SeongBo Shim: Innovator in Semiconductor Technology

Introduction

SeongBo Shim is a notable inventor based in Kyoung-gi-Do, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances electrical isolation in fine pitch bonding applications.

Latest Patents

SeongBo Shim holds a patent for a semiconductor device and method of forming an oxide layer on signal traces for electrical isolation in fine pitch bonding. This invention involves a semiconductor die with a solder bump on its surface, a contact pad on a substrate, and a signal trace with a pitch of less than 150 micrometers between them. The electroless surface treatment applied over the contact pad can include materials such as tin, ENIG, or OSP. A film layer is formed over the contact pad with an opening over the signal trace, while an oxide layer is created over the signal trace. This design ensures that even if the solder bump contacts the oxide layer, electrical isolation is maintained.

Career Highlights

SeongBo Shim is currently employed at Stats Chippac Pte. Ltd., where he continues to advance semiconductor technologies. His work has been instrumental in improving the reliability and performance of semiconductor devices.

Collaborations

Throughout his career, SeongBo has collaborated with talented colleagues, including KyungOe Kim and YongHee Kang. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

SeongBo Shim's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. His patent reflects a commitment to enhancing electrical isolation in semiconductor devices, showcasing his expertise and dedication to advancing technology.