Cheongju, South Korea

Seon Ho Shin

This inventor holds 3 USPTO granted patents. Top assignee: Daebo Housing Co., Ltd. Active years: 2014-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seon Ho Shin. Retrieved from https://idiyas.com/inventor/seon-ho-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 15(Granted Patents)


Location History:

  • Dongducheon-si, KR (2014)
  • Cheongju-si, KR (2021)

Company Filing History:


Years Active: 2014-2021

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3 patents (USPTO):Explore Patents

Title: Seon Ho Shin: Innovator in Cutting Insert Technology

Introduction

Seon Ho Shin is a notable inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of cutting insert technology, holding a total of 3 patents. His work is recognized for its innovation and practical applications in various industries.

Latest Patents

One of Seon Ho Shin's latest patents is a cutting insert, which showcases his expertise in developing advanced tools for manufacturing processes. This invention is designed to enhance efficiency and precision in cutting operations.

Career Highlights

Seon Ho Shin is currently employed at Daebo Housing Co., Ltd., where he continues to innovate and contribute to the company's success. His role involves not only the development of new technologies but also the improvement of existing products.

Collaborations

Throughout his career, Seon Ho Shin has collaborated with talented individuals such as Ki Chan Nam and Nam Seon Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise.

Conclusion

Seon Ho Shin's contributions to cutting insert technology and his collaborative spirit highlight his importance in the field of innovation. His work continues to influence the industry and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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