Seok Geun Ahn

Title: Seok Geun Ahn: Innovator in Semiconductor Packaging

Introduction

Seok Geun Ahn is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of four patents. His work focuses on innovative methods and designs that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Ahn's latest patents include a semiconductor package and a method of fabricating the same. The first patent discloses semiconductor packages that consist of a package substrate, a redistribution layer, and vertical connection terminals. This design allows for a first semiconductor chip to be placed between the package substrate and the redistribution layer, with a first molding layer filling the space between them. Additionally, a second and third semiconductor chip are integrated into the package, with connection wires that ensure efficient communication between the components. The second patent describes a semiconductor package that features a first substrate and a second substrate, with a mold layer filling a recess formed at the edge of the second substrate. This innovative design improves the overall structure and performance of the semiconductor package.

Career Highlights

Seok Geun Ahn is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's reputation for innovation.

Collaborations

Ahn has collaborated with notable coworkers, including Sun Chul Kim and Sang Soo Kim. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge semiconductor solutions.

Conclusion

Seok Geun Ahn's contributions to semiconductor packaging exemplify the spirit of innovation in the technology industry. His patents reflect a commitment to advancing semiconductor technology, making him a key figure in this field.