Company Filing History:
Years Active: 2000-2002
Title: Seizo Nemoto: Innovator in Reflow Soldering Technology
Introduction
Seizo Nemoto is a notable inventor based in Nihonmatsu, Japan. He has made significant contributions to the field of electronics, particularly in the area of reflow soldering technology. With a total of 2 patents to his name, Nemoto's work has had a considerable impact on the efficiency and effectiveness of soldering processes in electronic manufacturing.
Latest Patents
Nemoto's latest patents focus on a reflow method and reflow device designed for reflow soldering. This innovative method applies radiant heating to one surface of a printed circuit board, where electronic components are placed and cream solder is supplied. Simultaneously, hot air is blown locally and roughly perpendicular to the points that need to be connected on the printed circuit board. This approach allows for secure soldering, even when the hot air temperature does not exceed the heat resistance of the electronic components. The combination of radiant heat and localized hot air enables selective heating of only the to-be-connected points, preventing heat damage to other sections of the board. This ensures that the solder at the connection points is effectively melted, enhancing the reliability of the soldering process.
Career Highlights
Seizo Nemoto is associated with Matsushita Electric Industrial Co., Ltd., a company known for its advancements in electronic technology. His work has contributed to the development of more efficient soldering techniques, which are crucial for the production of reliable electronic devices.
Collaborations
Throughout his career, Nemoto has collaborated with notable colleagues, including Masahiro Taniguchi and Kazumi Ishimoto. These collaborations have likely fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Seizo Nemoto's contributions to reflow soldering technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to improving manufacturing processes, ensuring that electronic components are soldered securely and efficiently.