Tokyo, Japan

Seizo Murayama

This inventor holds 1 USPTO granted patent. Top assignee: The Fujikura Cable Works Limited. Active years: 1984.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1984

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1 patent (USPTO):Explore Patents

Title: Seizo Murayama: Innovator in Anodic Oxide Film Technology

Introduction

Seizo Murayama is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the treatment of anodic oxide films. His innovative approach has led to advancements that are beneficial for various electronic applications.

Latest Patents

Murayama holds a patent for a process of treating an anodic oxide film, which is crucial for the development of printed wiring boards. The patent describes a method where a base material of a valve metal is anodized to form an anodic oxide film. This film is then impregnated with a polymerizable organic metal compound and subjected to polymerization. The result is a base material with an anodic oxide film that is filled and sealed with a polymerized organometallic compound. This process enhances the material's heat resistance, heat radiance, and electrical insulation properties, making it ideal for applications such as printed wiring boards, electrically-insulative heat sinks, and heat-resistant insulated wires. He has 1 patent to his name.

Career Highlights

Seizo Murayama is associated with Fujikura Cable Works Limited, a company known for its innovations in cable and wiring technologies. His work has been instrumental in developing materials that meet the demands of modern electronics.

Collaborations

Murayama has collaborated with notable colleagues such as Kazuo Isawa and Masatsugu Maejima. Their combined expertise has contributed to the advancement of technologies in their field.

Conclusion

Seizo Murayama's contributions to anodic oxide film technology exemplify the impact of innovative thinking in materials science. His patented process not only enhances the performance of electronic components but also showcases the importance of collaboration in driving technological advancements.

Profile summary based on public USPTO records.
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