Nagano, Japan

Seiya Yuki

This inventor holds 1 USPTO granted patent. Top assignee: Dowa Metaltech Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiya Yuki. Retrieved from https://idiyas.com/inventor/seiya-yuki-umv0ffv7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seiya Yuki and His Work on Insulating Substrates.

Introduction

Seiya Yuki is an inventor associated with Dowa Metaltech Co., Ltd. in Nagano, Japan. His patent work focuses on insulating substrates designed to combine reliable manufacturing performance with durability under thermal cycling.

Latest Patents

Yuki is named on 1 patent: “Insulating Substrate and Manufacturing Method Thereof.” The invention describes a ceramic substrate joined to a heat-dissipation-side metal plate by a brazing material layer. A nickel plating layer covers the exposed brazing material between the ceramic and metal, while at least part of the metal plate’s opposite surface remains unplated.

The design aims to improve the substrate’s resistance to furnace processing and its heat-cycle characteristics when a heat-sink plate is soldered to it.

Career Highlights

Yuki’s listed patent reflects work on materials and manufacturing methods for insulating substrates used in heat-dissipation applications. The invention addresses the balance between furnace-processing reliability and performance during repeated temperature changes.

Collaborations

Yuki’s named coworkers include Takashi Ideno and Junichi Kinoshita. The patent is associated with Dowa Metaltech Co., Ltd.

Conclusion

Seiya Yuki’s patent centers on a plated-and-brazed insulating substrate intended to support reliable manufacturing and improved thermal-cycle performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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