Company Filing History:
Years Active: 2001
Title: Seishiro Ohashi: Innovator in Wire Saw Technology
Introduction
Seishiro Ohashi is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of wire saw technology, holding 2 patents that showcase his innovative approach to material cutting.
Latest Patents
Ohashi's latest patents include a wire for a wire saw apparatus and a cutting system utilizing abrasive grain-bonded saw wires. The first patent describes a wire designed for slicing materials, which consists of an element wire, a binder, and abrasive grains. The element wire is made from high tensile strength metal, while the binder is composed of organic or inorganic materials. The abrasive grains are held on the surface of the element wire by the binder, which can be made from natural quartz glass or high purity synthesis quartz glass. The second patent outlines a cutting system that employs abrasive grain-bonded saw wires arranged on a long tape base material. This innovative system allows for efficient cutting of materials by applying tension to the saw wire assembly.
Career Highlights
Seishiro Ohashi is currently employed at Hitachi Cable, Inc., where he continues to develop and refine his inventions. His work has significantly impacted the efficiency and effectiveness of cutting technologies in various industries.
Collaborations
Ohashi has collaborated with notable coworkers, including Shinichi Okada and Kenji Asano, contributing to advancements in their respective fields.
Conclusion
Seishiro Ohashi's contributions to wire saw technology exemplify the spirit of innovation. His patents reflect a commitment to improving material cutting processes, making him a valuable figure in the field.