The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2001
Filed:
Nov. 07, 1997
Applicant:
Inventors:
Seishiro Ohashi, Ibaraki, JP;
Shinichi Okada, Ibaraki, JP;
Kenji Asano, Ibaraki, JP;
Kazunori Suzuki, Ibaraki, JP;
Masahiro Sakamoto, Ibaraki, JP;
Assignee:
Hitachi Cable Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/500 ;
U.S. Cl.
CPC ...
B32B 1/500 ;
Abstract
A wire for a wire saw apparatus for slicing a material includes an element wire, a binder coated on an outside circumferential surface of the element wire, and abrasive grains dispersed in the binder. The element wire is a high tensile strength metal wire, the binder is a material such as an organic or inorganic material other than a metal, and the abrasive grains are held on a surface of the element wire by the binder. The element wire is also made by either a natural quartz glass or a high purity synthesis quartz glass.