This inventor holds 1 USPTO granted patent. Top assignee: Sony Corporation. Active years: 1995.
Company Filing History:
Years Active: 1995
Title: Seimi Ishii: Innovator in Printed Circuit Board Technology
Introduction
Seimi Ishii is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of printed circuit board technology. His innovative work has led to the development of a unique patent that enhances the functionality of printed circuit boards.
Latest Patents
Seimi Ishii holds a patent for a printed circuit board having a through-hole stopped with photo-curable solder resist. This invention discloses a printed circuit board that features a through-hole in a land. A solder resist made of photo-curable material is formed on the substrate surface of the printed circuit board, and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. Notably, if a land on which a chip component is mounted co-exists with a land for a discrete component, only the through-hole in the land for the chip component is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed through selective light exposure from both the front and reverse surfaces of the substrate.
Career Highlights
Seimi Ishii is currently employed at Sony Corporation, where he continues to innovate and contribute to advancements in technology. His work at Sony has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of his notable coworkers include Nobuyuki Yasuda and Hirohisa Amago. Their collaborative efforts have further enhanced the development of innovative technologies within the company.
Conclusion
Seimi Ishii's contributions to printed circuit board technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic components.