Seil Oh

Title: Seil Oh: Innovator in Through-Silicon Via Technology

Introduction

Seil Oh is a prominent inventor based in Suwon-si, South Korea. He is known for his contributions to semiconductor technology, particularly in the area of through-silicon via (TSV) technology. His innovative work has led to advancements in overlay measurement techniques, which are crucial for the development of modern semiconductor devices.

Latest Patents

Seil Oh holds a patent for a through-silicon via (TSV) key for overlay measurement, which includes a first TSV extending through at least a portion of a substrate in a first direction that is perpendicular to a top surface of the substrate. The invention also features at least one ring pattern that surrounds the first TSV in a second direction parallel to the top surface of the substrate. This design allows for precise overlay measurements, enhancing the performance of semiconductor devices and packages that incorporate the TSV key. He has 1 patent to his name.

Career Highlights

Seil Oh is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge semiconductor technologies, contributing to the company's reputation for innovation and excellence in the electronics industry.

Collaborations

Throughout his career, Seil Oh has collaborated with talented individuals such as Yongyeop Kim and Eunji Kim. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in the semiconductor field.

Conclusion

Seil Oh's work in through-silicon via technology exemplifies the innovative spirit of the semiconductor industry. His contributions continue to influence the development of advanced electronic devices, showcasing the importance of innovation in technology.