This inventor holds 2 USPTO granted patents. Top assignee: Kureha Kagaku Kogyo K.k.. Active years: 1993-1994.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1993-1994
Title: Seiichi Ohira: Innovator in Abrasive Filament Technology
Introduction
Seiichi Ohira is a notable inventor based in Kitaibaraki, Japan. He has made significant contributions to the field of abrasive filament technology, holding a total of 2 patents. His work focuses on the development of advanced materials that enhance the performance of abrasive products.
Latest Patents
Ohira's latest patents include innovative abrasive filaments made from a unique composition. These filaments consist of 95-70 vol.% of a polyvinylidene fluoride resin, with an inherent viscosity ranging from 0.9 to 1.4, and 5-30 vol.% of abrasive grains. The production process involves melt-spinning the composition and stretching the resultant filaments at a draw ratio of 2.5 to 5.5 times within a temperature range of 100-200 degrees Celsius. This method results in high-quality abrasive filaments that are effective for various applications.
Career Highlights
Seiichi Ohira is associated with Kureha Kagaku Kogyo K.K., where he continues to innovate and develop new products. His expertise in material science and engineering has positioned him as a key figure in the advancement of abrasive technologies.
Collaborations
Ohira has collaborated with talented coworkers such as Tomoo Susa and Hiroyuki Endo. Their combined efforts contribute to the ongoing research and development initiatives at their company.
Conclusion
Seiichi Ohira's work in abrasive filament technology exemplifies the spirit of innovation. His patents and contributions to Kureha Kagaku Kogyo K.K. highlight the importance of advanced materials in industrial applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
