Seiichi Nakazato

Title: Seiichi Nakazato: Innovator in Bonded Can Technology

Introduction

Seiichi Nakazato is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of packaging technology, particularly in the development of bonded cans. With a total of 2 patents to his name, Nakazato's work has had a considerable impact on the industry.

Latest Patents

Nakazato's latest patents focus on the process for the production of bonded cans of the key-opening type. The first patent discloses a bonded can that comprises a coated metal blank and a seam formed by lap-bonding the outer and inner end edge portions of the coated metal blank using a tape of a thermoplastic resin adhesive. The adhesive used is either a polyamide type or a polyester type. The inner end edge portion forming the seam is completely covered with the adhesive tape, while the outer edge portion features a winding-starting tongue piece integrated with it. A plurality of scores are formed on the outer surface of the coated metal blank, which have a knife angle of 45 to 120 degrees and a depth corresponding to 8 to 45% of the thickness of the metal blank. Additionally, a coating of epoxy resin with a thermal softening point of 65 to 150 degrees Celsius is formed at least at the seam-forming part on the outer surface, ensuring a continuous layer that adheres closely to the metal blank, even in the scored areas.

Career Highlights

Seiichi Nakazato is associated with Toyo Seikan Kaisha, Ltd., a leading company in the packaging industry. His innovative work has contributed to advancements in can technology, enhancing the functionality and usability of packaged products.

Collaborations

Throughout his career, Nakazato has collaborated with notable colleagues, including Atsushi Nunokawa and Seishichi Kobayashi. These collaborations have further enriched his contributions to the field.

Conclusion

Seiichi Nakazato's innovative work in the development of bonded can technology showcases his expertise and dedication to improving packaging solutions. His patents reflect a commitment to advancing the industry and enhancing product usability.