Tokyo, Japan

Seichii Kuboniwa

This inventor holds 1 USPTO granted patent. Top assignees: Mag Co., Ltd., Saint Gobain Isover. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seichii Kuboniwa. Retrieved from https://idiyas.com/inventor/seichii-kuboniwa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Seichii Kuboniwa: Innovator in Thermal Insulation Technology

Introduction

Seichii Kuboniwa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of thermal insulation technology. His innovative approach has led to the development of materials that enhance energy efficiency in buildings.

Latest Patents

Kuboniwa holds a patent for a composite thermally insulating material. This material is designed for use in houses and demonstrates high thermal insulation performance when packed into a restricted cavity between outer and inner walls. The composite consists of two sheet-shaped fiber-based thermally insulating materials and a vacuum thermally insulating material incorporated between them. The region between these materials can be secured with an adhesive agent, ensuring optimal performance.

Career Highlights

Throughout his career, Seichii Kuboniwa has worked with prominent companies in the industry. He has been associated with Mag Co., Ltd. and Saint Gobain Isover, where he has applied his expertise in developing advanced insulation solutions.

Collaborations

Due to space constraints, the details of his collaborations will not be included.

Conclusion

Seichii Kuboniwa's contributions to thermal insulation technology reflect his innovative spirit and dedication to improving energy efficiency in construction. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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