Fujieda, Japan

Sei Nakamichi


Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1998-1999

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3 patents (USPTO):Explore Patents

Title: Sei Nakamichi: Innovator in Multilayer Printed Circuit Board Technology

Introduction

Sei Nakamichi is a prominent inventor based in Fujieda, Japan. He has made significant contributions to the field of multilayer printed circuit board technology. With a total of three patents to his name, Nakamichi's work focuses on enhancing the efficiency and precision of circuit board production.

Latest Patents

Nakamichi's latest patents include an "Insulating adhesive for multilayer printed circuit board" and a "Process for producing multilayer printed circuit board." The insulating adhesive is designed to be laminated to an internal layer circuit board that is coated with an epoxy resin and a curing agent. This innovative adhesive comprises essential components that improve the overall performance of multilayer printed circuit boards. The process for producing these boards involves coating a light and heat curable undercoating agent on an internal layer circuit board, which is then irradiated with active energy beams to make it tack-free. This method allows for the lamination of a metal foil with an insulating adhesive layer, resulting in a product with excellent board thickness precision.

Career Highlights

Nakamichi is currently employed at Sumitomo Bakelite Company Limited, where he continues to develop cutting-edge technologies in the field of printed circuit boards. His work has been instrumental in advancing the capabilities of multilayer boards, making them more efficient and reliable for various applications.

Collaborations

Throughout his career, Nakamichi has collaborated with notable colleagues, including Takeshi Hosomi and Toyoaki Kishi. These partnerships have fostered innovation and have contributed to the successful development of new technologies in the industry.

Conclusion

Sei Nakamichi's contributions to multilayer printed circuit board technology exemplify his dedication to innovation and excellence. His patents and ongoing work at Sumitomo Bakelite Company Limited continue to shape the future of electronic manufacturing.

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