Company Filing History:

9 out of 5,349

Rca Inc.

patents

4 out of 777

Varian Associates, Inc.

patents

Years Active: 1976-1989

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 4869420 - Method of diffusion bonding and densifying material of a heater element (1989-09-26),

2. 4851057 - Method of diffusion bonding and densifying material (1989-07-25),

3. 4717067 - Diffusion bonded structure and method of making (1988-01-05),

4. 4601331 - Multiple heat pipes for linear beam tubes having common coolant and (1986-07-22),

5. 4386362 - Center gate semiconductor device having pipe cooling means (1983-05-31),

6. 4327370 - Resilient contact ring for providing a low impedance connection to the (1982-04-27),

7. 4291324 - Semiconductor power device having second breakdown protection (1981-09-22),

8. 4258383 - Minimum pressure drop liquid cooled structure for a semiconductor device (1981-03-24),

9. 4253105 - Semiconductor power device incorporating a schottky barrier diode (1981-02-24),

10. 4126879 - Semiconductor device with ballast resistor adapted for a transcalent (1978-11-21),

11. 3984861 - Transcallent semiconductor device (1976-10-05),

12. 3978518 - Reinforced transcalent device (1976-08-31),

13. 3946429 - Self-fusing transcalent electrical device (1976-03-23),

Title: The Innovations of Sebastian W Kessler, Jr.

Introduction

Sebastian W Kessler, Jr. is a notable inventor based in Lancaster, PA (US), recognized for his contributions to the field of materials science. With a total of 13 patents to his name, Kessler has made significant advancements in the methods of bonding and densifying refractory metals and ceramics.

Latest Patents

Among his latest patents is a method of diffusion bonding and densifying material of a heater element. This innovative process involves assembling the workpieces to be bonded, wrapping the assembly with carbon yarn, heating the wrapped assembly, cooling it, and then unwrapping it. The expansion of the workpieces, combined with the shrinking of the carbon yarn, generates tremendous pressures that facilitate the bonding and densifying of the workpiece. Another patent details a similar method of diffusion bonding and densifying material, showcasing Kessler's expertise in this area.

Career Highlights

Throughout his career, Kessler has worked with prominent companies such as RCA Inc. and Varian Associates, Inc. His experience in these organizations has contributed to his development as an inventor and has allowed him to refine his innovative techniques.

Collaborations

Kessler has collaborated with notable individuals in his field, including John A Olmstead and Robert E Reed. These partnerships have likely enriched his work and expanded the impact of his inventions.

Conclusion

Sebastian W Kessler, Jr. stands out as a significant figure in the realm of innovation, particularly in the bonding and densifying of materials. His patents reflect a deep understanding of material science and a commitment to advancing technology.

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