The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 1976
Filed:
Jan. 09, 1975
Sebastian William Kessler, Jr, Lancaster, PA (US);
RCA Corporation, New York, NY (US);
Abstract
Metal plates of tungsten or molybdenum, having an optimum thickness of 1000 micrometers or less, are bonded to respective cathode and anode electrical coatings on the opposed major surfaces of a semiconductor wafer. The metal plates in turn are conductively bonded to the heat pipe walls which are used as the electrical connectors between the anode and cathode coatings and the external working circuit. Heat that is developed by the surge current flowing through the wafer during the first 6 milliseconds, is dissipated into the plates that are bonded to the opposed major surfaces of the wafer, before the cooling capability of the heat pipes is effective. This provides a greater surge current capability for the semiconductor wafer.