Sebastian Pahlke

Title: Sebastian Pahlke: Innovator in Chip Carrier Technology

Introduction

Sebastian Pahlke is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of electronics, particularly in the development of chip carrier technology. His innovative work has led to the creation of a patent that addresses critical challenges in the industry.

Latest Patents

Sebastian Pahlke holds a patent for a "Chip carrier laminate with high frequency dielectric and thermomechanical buffer." This invention involves a chip carrier designed to support an encapsulated electronic chip. The chip carrier features a laminate structure composed of multiple electrically insulating and conductive structures. It includes a chip coupling area that allows for both electrical and mechanical connections to the encapsulated chip. One of the insulating structures is specifically designed as a high-frequency dielectric, which is compatible with low-loss transmission of high-frequency signals. Additionally, the design incorporates a thermomechanical buffer to mitigate thermally induced mechanical loads.

Career Highlights

Sebastian Pahlke is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to work on cutting-edge technologies that enhance the performance and reliability of electronic devices. His expertise in chip carrier technology has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Sebastian has collaborated with several talented individuals, including Martin Richard Niessner and Walter Hartner. These collaborations have fostered an environment of innovation and have contributed to the advancement of technology in their field.

Conclusion

Sebastian Pahlke is a distinguished inventor whose work in chip carrier technology has made a significant impact on the electronics industry. His patent reflects his commitment to innovation and excellence in engineering.