Scott William Huffer

Hartsville, SC, United States of America

Scott William Huffer

This inventor holds 118 USPTO granted patents and 24 published patent applications, plus 32 CIPO patents and 37 EPO patents, primarily in Flexible Packaging (CPC class B32B7-12). Top assignees: Sonoco Development Incorporated, Toppan Packaging Americas Holdings, Inc., Avery Dennison Corporation. Active years: 1996-2026.

USPTO Granted Patents = 118 

% Patents Active = 93.2

 

 

Average Co-Inventor Count = 1.4

ph-index = 16

Forward Citations = 895(Granted Patents)

Forward Citations (Not Self Cited) = 558(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Lake City, MI (US) (1996)
  • Crown Point, IN (US) (1996 - 1999)
  • Lancaster, SC (US) (2002 - 2003)
  • Hartsville, SC (US) (2002 - 2024)

Company Filing History:


Years Active: 1996-2026

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Areas of Expertise:
Resealable Flexible Packaging
Tamper-Evident Features
Easy-Open Structures
Ovenable Containers
Recyclable Paper
Child-Resistant Closure
Peelable Membrane
Self-Heating Containers
Magnetic Reseal
Integrated Zipper Closure
Flexible Packaging Structure
Venting System
118 patents (USPTO):Explore Patents

Scott William Huffer, a resident of Hartsville, SC (US), is an esteemed inventor with an impressive portfolio of 87 patents. Let's take a close look at some of his latest patents, showcasing his innovative mindset.

1. Child-resistant closure: Huffer's invention focuses on a lid designed to securely close the open end of a container. The lid consists of a track, insertion points, and retention regions. A ring, placed around the container, has posts that can be inserted into the insertion points and locked within the retention regions. The ring and the lid are rotatable between locked and unlocked positions, providing a child-resistant closure mechanism.

2. Resealable flexible packaging: In this patent, Huffer presents a flexible packaging solution. The packaging comprises a base layer and a film layer affixed to it via a pressure-sensitive adhesive layer. The adhesive layer includes adhesive zones and adhesive-free zones that extend continuously in a machine direction. The film layer is scored to create pull tabs within the adhesive-free zones, while the base layer includes cavities adjacent to the adhesive-free zones, allowing for easy resealing.

Throughout his career, Huffer has worked with various companies, including Sonoco Development Incorporated and Rechargeable Battery Corporation. These collaborations have likely contributed to his expertise and the development of his inventive concepts.

Furthermore, it's worth noting that Huffer has had the opportunity to work alongside notable colleagues such as Jeffrey M. Schuetz and Robert Charles Hebert. Their combined knowledge and collaboration may have led to further advancements in the field of innovations and patents.

As an AI assistant on idiyas.com, we are dedicated to providing comprehensive information on inventors, their inventions, and patents. Scott William Huffer's contributions undoubtedly exemplify the impact of innovative ideas in various industries.

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