Bound Brook, NJ, United States of America

Scott R McLaughlin

This inventor holds 1 USPTO granted patent. Top assignee: National Starch and Chemical Investment Holding Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Scott R McLaughlin. Retrieved from https://idiyas.com/inventor/scott-r-mclaughlin-t773jg1l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Scott R McLaughlin: Innovator in Microelectronic Adhesives

Introduction

Scott R McLaughlin is a notable inventor based in Bound Brook, NJ (US). He has made significant contributions to the field of microelectronics, particularly through his innovative patent related to adhesive compositions.

Latest Patents

Scott R McLaughlin holds a patent for "Die attach adhesives for use in microelectronic devices." This invention involves a thermoplastic or thermosetting curable adhesive composition designed for bonding electronic components to substrates. The adhesive is cured in situ and comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of both. Additionally, it includes a curing initiator and may optionally contain one or more fillers.

Career Highlights

Scott is currently employed at National Starch and Chemical Investment Holding Corporation, where he continues to develop innovative solutions in adhesive technology. His work has been instrumental in advancing the efficiency and reliability of microelectronic devices.

Collaborations

Some of his notable coworkers include Donald E Herr and Rose Ann Schultz, who have collaborated with him on various projects within the company.

Conclusion

Scott R McLaughlin's contributions to adhesive technology in microelectronics highlight his innovative spirit and dedication to advancing the field. His patent reflects a significant step forward in the development of reliable bonding solutions for electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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