Scott Preston Moore

Title: Scott Preston Moore: Innovator in Electronic Packaging

Introduction

Scott Preston Moore is a notable inventor based in Apalachin, NY (US). He has made significant contributions to the field of electronic packaging, holding a total of 9 patents. His work focuses on optimizing electronic devices for better thermal management and efficiency.

Latest Patents

One of his latest patents is titled "Optimization of electronic package geometry for thermal dissipation." This invention discloses an electronic package device that includes a microelectronic package and a heat sink positioned over it. A thermal interface element is placed between the microelectronic package and the heat sink, featuring an elongated design with varying thicknesses to enhance heat dissipation. Another significant patent is the "Polytetrafluoroethylene thin film chip carrier." This invention provides an organic chip carrier particularly useful with flip chips. It comprises an organic dielectric layer, a first layer of circuitry, and a conformational coating, all designed to improve the performance and efficiency of electronic devices.

Career Highlights

Scott Preston Moore is associated with the International Business Machines Corporation (IBM), where he has contributed to various innovative projects. His expertise in electronic packaging has positioned him as a key player in the development of advanced technologies.

Collaborations

Throughout his career, Scott has collaborated with notable colleagues, including James Warren Wilson and John Steven Kresge. These collaborations have further enriched his work and contributed to the advancement of electronic packaging technologies.

Conclusion

Scott Preston Moore is a distinguished inventor whose work in electronic packaging has led to significant advancements in the field. His innovative patents and contributions to IBM highlight his commitment to enhancing electronic device performance.