Company Filing History:
Years Active: 1991
Title: Scott P Doran: Innovator in Multichip Circuit Packaging
Introduction
Scott P Doran is a notable inventor based in Wakefield, MA (US). He has made significant contributions to the field of electronics, particularly in the area of multichip circuit packaging. His innovative approach has led to the development of a unique method that enhances the assembly and interconnection of high-density circuits.
Latest Patents
Doran holds a patent for "Coplanar packaging techniques for multichip circuits." This patent describes a method for assembling and interconnecting large, high-density circuits from separately fabricated components. The process allows for conventional preassembly device testing and production techniques to be employed in a straightforward manner. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is subsequently dissolved, exposing the connection side of the chips, to which electrical connections can then be made. This innovative technique simplifies the assembly process and enhances the efficiency of circuit production.
Career Highlights
Scott P Doran is affiliated with the Massachusetts Institute of Technology, where he has contributed to various research initiatives. His work has been instrumental in advancing the field of electronics and improving the functionality of multichip circuits.
Collaborations
Doran has collaborated with esteemed colleagues such as Jerry G Black and David K Astolfi. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Scott P Doran's contributions to multichip circuit packaging exemplify the spirit of innovation in the electronics industry. His patented techniques not only simplify the assembly process but also pave the way for future advancements in high-density circuit technology.