The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 1991
Filed:
Jun. 17, 1988
Applicant:
Inventors:
Jerry G Black, Lincoln, MA (US);
David K Astolfi, Littleton, MA (US);
Scott P Doran, Wakefield, MA (US);
Daniel J Ehrlich, Lexington, MA (US);
Assignee:
Massachusetts Institute of Technology, Cambridge, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437219 ; 437974 ; 26427217 ; 156155 ;
Abstract
A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is then dissolved, exposing the connection side of the chips, to which electrical connections can then be made.