Company Filing History:
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Years Active: 1994-2001
Title: Scott M Westbrook: Innovator in High Density Interconnect Technology
Introduction
Scott M Westbrook is a notable inventor based in Los Altos, California. He has made significant contributions to the field of high density interconnect technology, holding a total of 2 patents. His work focuses on methods that enhance the performance and reliability of electrical interconnection devices.
Latest Patents
Westbrook's latest patents include a method for controlling stress in thin film layers deposited over a high density interconnect common circuit base. This method involves forming a thin film conductive layer over a dielectric layer and patterning it to ensure it overlaps the edges of conductive lines by at least 10 microns. Additionally, he has developed a high density electrical interconnection device that features a uniform complementary pattern of thieving lines on both X and Y interconnect layers. This design aims to improve the uniformity of plating copper conductors and reduce the contraction and expansion of the insulating substrate.
Career Highlights
Throughout his career, Scott M Westbrook has worked with prominent companies such as Kulicke & Soffa Holdings, Inc. and Digital Equipment Corporation. His experience in these organizations has allowed him to refine his expertise in electrical interconnection technologies.
Collaborations
Westbrook has collaborated with notable professionals in his field, including Jan I Strandberg and Gelston Howell. These partnerships have contributed to the advancement of his innovative projects.
Conclusion
Scott M Westbrook is a distinguished inventor whose work in high density interconnect technology has led to significant advancements in the field. His patents reflect a commitment to improving electrical interconnection devices, showcasing his expertise and innovative spirit.