Trenton, OH, United States of America

Scott M Miller

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Packaging Corporation of America. Active years: 2012-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Scott M Miller. Retrieved from https://idiyas.com/inventor/scott-m-miller

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2012-2022

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3 patents (USPTO):Explore Patents

Title: Scott M. Miller: Innovator in Packaging Solutions

Introduction

Scott M. Miller is a notable inventor based in Trenton, Ohio. He has made significant contributions to the field of packaging through his innovative designs. With a total of 3 patents to his name, Miller continues to push the boundaries of packaging technology.

Latest Patents

Miller's latest patents include a "Tray with Cellular Back and Side Walls" and a "Displayable Shipping Container." The tray features a unique design with a back wall, side walls, and a bottom, incorporating a multilayered corner reinforcing structure for enhanced durability. The shipping container patent outlines a design that includes multiple panels and flaps, allowing for efficient packaging and display.

Career Highlights

Scott M. Miller is currently employed at Packaging Corporation of America, where he applies his expertise in packaging design. His work has been instrumental in developing innovative solutions that meet the needs of various industries.

Collaborations

Miller collaborates with talented individuals such as Jackie E. Bell and Nicholas A. Philips, contributing to a dynamic team focused on advancing packaging technology.

Conclusion

Scott M. Miller is a dedicated inventor whose work in packaging has led to several innovative patents. His contributions continue to shape the industry and inspire future advancements in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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