Hsinchu, Taiwan

Scott Lin

This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Scott Lin. Retrieved from https://idiyas.com/inventor/scott-lin-u231h68l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Scott Lin - Innovator in Vapor Deposition Technology

Introduction

Scott Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of vapor deposition technology. His innovative work has led to the development of a patent that enhances the efficiency of vapor deposition processes.

Latest Patents

Scott Lin holds a patent for a "Seal for an assembly in a vapor deposition chamber." This invention addresses critical challenges in maintaining the integrity of vapor deposition systems, ensuring optimal performance and reliability.

Career Highlights

Scott Lin is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His role involves advancing technologies that are essential for manufacturing high-performance electronic devices.

Collaborations

Scott has collaborated with notable colleagues, including Yao-Hung Yang and Eric Ruhland. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Scott Lin's innovative contributions to vapor deposition technology and his collaboration with talented colleagues highlight his importance in the field. His work continues to influence advancements in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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