Scott J Jewler

Title: Scott J Jewler: Innovator in Integrated Circuit Packaging

Introduction

Scott J Jewler is a notable inventor based in Gilbert, AZ (US), recognized for his contributions to the field of integrated circuit packaging. With a total of three patents to his name, Jewler has made significant advancements in the design and manufacturing of plastic integrated circuit device packages.

Latest Patents

Jewler's latest patents include a "Plastic integrated circuit device package and method for making the package." This invention describes a package for an integrated circuit device that features a die, a die pad, leads, bond wire, and an encapsulant. The design incorporates stepped profiles on the lower surfaces of the die pad and leads, along with structures extending from the lateral sides of the leads to prevent horizontal movement. The encapsulant material fills the recessed areas, ensuring stability and connectivity for the package. Another patent, "Methods for moding a leadframe in plastic integrated circuit devices," outlines techniques for creating packages and leadframes. This method involves etching to create a stepped profile and applying encapsulant material to secure the components while allowing for external connections.

Career Highlights

Throughout his career, Jewler has worked with prominent companies, including Amkor Technology, Inc. His experience in the industry has allowed him to refine his skills and contribute to innovative solutions in integrated circuit packaging.

Collaborations

Jewler has collaborated with notable professionals in the field, including Thomas P Glenn and David T Roman. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Scott J Jewler's work in integrated circuit packaging has led to significant advancements in the industry. His patents reflect a commitment to innovation and a deep understanding of the technical challenges in this field.