Scott A Bennett

Title: Scott A Bennett: Innovator in Electronic Circuit Substrate Construction

Introduction

Scott A Bennett is a notable inventor based in Trenton, NJ (US). He has made significant contributions to the field of electronic circuit substrates, showcasing his expertise through his innovative patent.

Latest Patents

Scott A Bennett holds a patent for an electronic circuit substrate construction. This invention involves the formation of a microwave substrate by thermocompression bonding a metalization system layer to two substrates that possess corresponding properties. One of the properties in one material is significantly different in value than that property in the other material. The substrates are selected from polycrystalline and monocrystalline ceramic materials. The bonded slabs are then sliced and ground planes are attached to create finished composite substrates.

Career Highlights

Scott A Bennett is associated with General Electric Company, where he applies his knowledge and skills in the development of advanced technologies. His work has contributed to the enhancement of electronic circuit designs and applications.

Collaborations

Scott has collaborated with notable coworkers, including Richard N Brown and Virgil L Lawson, who have also contributed to advancements in their respective fields.

Conclusion

Scott A Bennett's innovative work in electronic circuit substrate construction exemplifies his commitment to advancing technology. His contributions continue to impact the industry positively.