Tokyo, Japan

Sayaka Hirafune

USPTO Granted Patents = 3 


 

Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 81(Granted Patents)


Location History:

  • Toyko, JP (2007)
  • Tokyo, JP (2007 - 2008)

Company Filing History:


Years Active: 2007-2008

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3 patents (USPTO):Explore Patents

Title: Sayaka Hirafune: Innovator in Semiconductor Technology

Introduction

Sayaka Hirafune is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of semiconductor technology, holding three patents to her name. Her work focuses on innovative methods for manufacturing semiconductor packages, which are essential components in modern electronics.

Latest Patents

One of her latest patents is a semiconductor package and method for manufacturing the same. This invention includes a first substrate made of a semiconductor base material with a functional element on one side. It features a first wiring and a pad that connects electrically to the functional element. Additionally, a through-hole interconnection is provided, which penetrates the semiconductor base material, including an insulating film and conductive material. The package is completed with a sealing material surrounding the functional element and a second substrate bonded to the first substrate.

Career Highlights

Sayaka has worked with notable companies such as Fujikura Limited and Olympus Corporation. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

She has collaborated with talented individuals in her field, including Tatsuo Suemasu and Michikazu Tomita. These partnerships have fostered innovation and creativity in her projects.

Conclusion

Sayaka Hirafune is a remarkable inventor whose work in semiconductor technology continues to impact the industry. Her patents reflect her dedication to innovation and her ability to solve complex engineering challenges.

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